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Dust-Free Plating LineModify Date : 2018-11-16 14:37:41
▣ Dust-Free Plating Line
※ Main Production Items
-Miniature MIC Terminal and Case
-CERAMIC PACKAGE
-CERAMIC CHIP
-Circuit components for ultra precision semiconductor communication
※ plating type
Gold plating (Au), silver plating (Ag), palladium (Pd), electroless nickel (Ni / p) plating
Electric, electronics, semiconductors, telecommunications, etc. are widely applicable, high efficiency, high function, ultra-small large capacity, excellent in lightening, mainly used by HARD GOLD plating, SOFT GOLD plating, Ni-P, Ni-B plating, etc.
○ Equipment and parts for semiconductors
○ Equipment and parts for communication
○ Medical devices and parts
○ Electrical and electronic components, etc.
○ Efficiency: Super-small, ultra-light, high-functional, SOLDERING, WIRE BONDING, DIE BONDING, etc. are excellent and have great heat dissipation effects.
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