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Jungwoo Easytech Co., Ltd

machinery & heavy equipment031-491-1082

RACK plating methodModify Date : 2018-11-16 14:37:41

▣ RACK Plating Line


※ Main Production Items

-LEAD FRAME

-Semiconductor and Communication CONTACT

-Package and HOUSING for optical communication

-F-PCB and polymate battery terminals

-CERAMIC PACKAGE and CHIP

     

※ plating type

-Hard Gold (Au: Hard Gold) / Au: Soft Gold / Silver (Ag) / Nickel (Nickel)


LEAD FRAMELEAD FRAMEANTENNA PLATING





- LEAD FRAME (Gold Plating)

    

By plating precise shape and functional products in a dipping manner, the guarantee of stable and uniform quality and productivity improvement are outstanding. gold, silver, and nickel plating

    

○ CONNECTOR for communication, parts for semiconductor

○ LCD and LED components

○ Normal TERMINAL type

○ Efficiency: uniformity of plating thickness, SOLDERING, conductivity, corrosion resistance, discoloration, abrasion resistance, etc.


- LEAD FRAME (silver plating)

 

○ LED for LCD

○ CONNECTOR for communication, parts for semiconductor

○ Efficiency: Uniformity of plating thickness, Wirebonding, conductivity, corrosion resistance, discoloration, etc.


- ANTENNA

 

It is a built-in component that transmits and receives radio signals from mobile phones and is gold plated to ensure high efficiency, continuity, and corrosion resistance.

 

○ PHONE INTENNA

○ LEAD FRAME for semiconductors

○ Efficiency: High function, conductivity, corrosion resistance, soldering, etc. of transmission and reception


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