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RACK plating methodModify Date : 2018-11-16 14:37:41
▣ RACK Plating Line
※ Main Production Items
-LEAD FRAME
-Semiconductor and Communication CONTACT
-Package and HOUSING for optical communication
-F-PCB and polymate battery terminals
-CERAMIC PACKAGE and CHIP
※ plating type
-Hard Gold (Au: Hard Gold) / Au: Soft Gold / Silver (Ag) / Nickel (Nickel)
LEAD FRAME | LEAD FRAME | ANTENNA PLATING |
- LEAD FRAME (Gold Plating)
By plating precise shape and functional products in a dipping manner, the guarantee of stable and uniform quality and productivity improvement are outstanding. gold, silver, and nickel plating
○ CONNECTOR for communication, parts for semiconductor
○ LCD and LED components
○ Normal TERMINAL type
○ Efficiency: uniformity of plating thickness, SOLDERING, conductivity, corrosion resistance, discoloration, abrasion resistance, etc.
- LEAD FRAME (silver plating)
○ LED for LCD
○ CONNECTOR for communication, parts for semiconductor
○ Efficiency: Uniformity of plating thickness, Wirebonding, conductivity, corrosion resistance, discoloration, etc.
- ANTENNA
It is a built-in component that transmits and receives radio signals from mobile phones and is gold plated to ensure high efficiency, continuity, and corrosion resistance.
○ PHONE INTENNA
○ LEAD FRAME for semiconductors
○ Efficiency: High function, conductivity, corrosion resistance, soldering, etc. of transmission and reception
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