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machinery & heavy equipment031-316-0014

BGA REBALLING 용 SOLDER BALLModify Date : 2020-08-12 09:32:51


BGA REBALLING 용 SOLDER BALL

Features and Advantages

Excellent precision, no surface oxidation and discoloration

Unique momentary development of ultrafine particle technology enables ultrafine particle homogenous

Quality assurance during manufacturing process due to size homogeneity, component homogeneity, and temperature homogeneity for use

The pitch is high because it makes a ball at once from the application.


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