C-2005 Sn/Pb 박리제

1. Does not include fluoride.

2. The range of working temperature is wide and fully capable at room temperature.

3. Fast stripping.

4. Keeps bright and glossy Copper surface.

5. The Sn/Pb solution is 100~130g/l.

CS-clean2000 EDC

1. advantageous in liquid management and use.

2. It contains organic compounds, so it has excellent deflash effect and exfoliation.

3. The conductivity in the solution is uniform and the effect on the material is uniform due to low surfaction.

4. The dispersants do not reattach contaminants or metals.

   It is possible to work in parallel.

5. The solution is sufficiently alkali-free and low-consumption ionized.
   can be kept steady

6. It does not contain silic acid chloride and does not survive after cleaning.

   SOLERABILITY IS IMPROVED.

7. There is little foam, so the gas is released quickly, so there is no risk of explosion.

8. The amount of evaporation is low and consumes less.

SOLDER STRIPPER

1. It does not contain any fluoride and ammonium ions, making wastewater treatment easy.

2. The range of working temperature is wide and fully capable at room temperature.

3. Fast stripping. (10∼12㎛)

4. Keeps bright and glossy Copper surface.

5. There is no production of suspended solids or sludge, making it easy to maintain equipment.

6. Copper Etching Rate is designed to be minimized.

7. Concentration analysis is not required during use.

8. It does not cause substrate milling.

 BELT STRIPPER

1. Wastewater treatment does not contain any fluoride, aromatic compounds and perfluoricates.
   Easy.

2. The working temperature range is wide, and sufficient capacity is exercised at room temperature.

3. Fast stripping. (30 to 35 μm/min)

4. Do not corrode the stainless steel apparatus.

5. No suspended solids or sludge.

6. Recommended solution for Sn/Pb 150g/Kg (Max. excel at 300 g/kg

 CS-3518 PHOTORESIST STRIPPER

1. Increases the stripping speed and keeps the stripping resist particles small and constant.

2. Prevent oxidation of the solder, Sn(tin), and Cu(Copper) to suppress the possibility of problems in the next process.

3. Prevent the formation of fluids or sticking materials by preventing the formation of NaOH, KOH, etc. and hydroxides.

4. Prevent dissipation of Na+ K+ ion to prevent contamination of other Baths.

5. Remove the Fragmented D/F particles by Overplate from the PCB manufacturing process.  

 CS-2007 COPPER ETCHING

1. ETCHING consistent with COPER surface and area of clean and uniform PINK MATTE

    You can get the depth.

2. High etching speed can be obtained in a short time at low temperatures, and rapidly dissolves copper or assimilating compound.

3. Applicable to both SPRAY and IMMERSION.

4. Does not contain kylate.

5. FUME, MIST is low and does not produce irritant odors.

6. Applicable as a plating preprocessor of the same product.