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FILM REMOVERModify Date : 2020-08-10 10:07:01
FILM REMOVER |
MODEL | CHARACTER | APPLICATION |
|
C-90 | PLASTIC MOLDING IC, etc. chronic Problem LEAD FRAME After Molding Above COMPOUND RESIDUE (FILM) It's a drug to remove. | Remove large parts of film, such as power transistors. (TO-3P,TO-220,TO-247, etc.) |
|
CS-11AK | |||
C-90A | |||
CS-8CO2 | SmallTR , IC film removal | ||
CS-8CU2 | |||
C-90A NEUTRALITY | For preventing nickel discoloration |
characteristic of C-90
1. Remove the film at 110°C to 130°C.
2. Since PH is 5.5 at 130°C, such as epoxy itself, there is no concern of discoloration or internal reaction. (Alkali products will be degraded by hydrolysis)
There is concern.)
3. If the oxide is removed without reacting to the lead frame components of Fe, Ni, Cu, etc. and immersed for a long time, there is no risk of damaging the lead frame.
4. Since Cu Lead Frame, etc. removes oxide film, it is safe to solder or plating without pretreatment.
5. The physical de-flashing process may be omitted due to the greater ability to remove the film under the same conditions as any chemicals found today.
6. Improve marking quality by removing Wax, Resin, and foreign substances on the package surface.
7. If the same amount of chemicals enter waste water, the COD (chemical oxygen demand) is relatively low, so water pollution is less likely.
8. Since the life expectancy is infinite, we only need to replenish the usage, so there is no waste generation.
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