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SOLDER PASTEModify Date : 2020-08-10 10:05:14
LEAD FREE SOLDER PASTE |
LEAD FREE SOLDER PASTE [ RoHS ]
HALOGEN FREE SOLDER PASTE [ H/F ]
MODEL | COMPOSITION | MELTING POINT | APPLICATION |
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CS-LF0307SAC | Sn0.3Ag0.7Cu | 221~227 ℃ | Low-cost double-sided PCB, etc. |
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CS-LF3AC | Sn3Ag0.5Cu | 217~220 ℃ | multilayer substrate, etc. | |
CS-LF571BA | Sn57Bi1Ag | 138~140 ℃ | LOW MELTING POINT N/C DISPENSER TYPE PRINTING TYPE Tuner , LED , biplane PCB, etc. | |
CS-LF5704BA | Sn57.6Bi1Ag | |||
CS-LF58B | Sn58Bi | |||
CS-LF07Cu | Sn0.7Cu | 227℃ | 퓨즈 등 | |
CS-LF5Sb | Sn5Sb | 240 ℃ | 콘덴서 등 |
◆ Characteristics of Cheongsol SOLDER PASTE
1. Low-latency changes during continuous printing, and stable printability can be achieved 2. Excellent Solder Paste with superior printability (0.3mm Pitch). 3. It's wet and has less saltiness. I can get it. 6. Minimal scattering of Micro Solder Ball or Flux causes problems with rapid heating, so the capillary ball has to be used. Very few occurrences. 7. Because it does not contain Pb, it protects the global environment and prevents ozone depletion. | |||
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◆ Recommended working conditions
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◆ Typical use of solder paste
1. If PREHEAT is insufficient, the MANHATTAN phenomenon and WICKING phenomenon will be observed if the temperature difference between the main heating time increases.
It may happen.
2. If the melting temperature is not sufficient, the contact time with the melt and the parent material is insufficient, resulting in good soldering and wetting.
be hard to get
3. The CHEMITEC solder paste shall be kept at an unopened temperature (1 to 5°C).
4. The viscosity of the solder paste changes due to the fine humidity caused by the temperature difference between inside and outside the container.
Let stand at the temperature of the workshop for at least 2 hours before using.
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