Description of Product

Oxygen Free Copper

Copper containing neither oxygen nor reducing agent, which is melted and cast or melted with reducing by charcoal in vacuum. Its oxygen content shall be 0.001%(10ppm) or less. It shows good electrical conductivity, no hydrogen brittleness and excellent machinability.

Pyrophosphate Copper

Adding phosphorus for deoxidization to tough pitch (electrolytic tough pitch, ETP) copper, which is obtained by melting and refining electrolytic copper, makes phosphorus deoxidized copper(DLP or DHP), which is to be transformed, with adequate quantity of phosphorus added, to pyrophosphate copper of which oxygen and residual phosphorus content should be 0.01% or less and 0.040 to 0.065%, respectively.

Use of Product

Application to PCB plating and undercoating(pyrophosphate copper ball)

Size Productible by Product Type


Ф55	54.0 ~ 56.5	800±10
Ф50	49.0 ~ 52.0	600±6
Ф45	43.5 ~ 46.0	425±6
Ф38	36.5 ~ 39.0	256±6
Ф30	28.5 ~ 31.0	125±5
Ф25	23.5 ~ 26.0	74±5
Ф11	9.5 ~ 13.0	7±3

Packing Available by Product Dimension

Nugget products are available on request

Perfect sphere products are available at the request of a customer who uses automatic input equipment.

Packing Unit: 20 kg / Paper box, 1,000 kg (50 boxes)

Chemical Composition and Mechanical Properties

Chemical composition


KS/JIS	UNIS	Cu	Pb	Fe	Sn	Zn	Others
-	C10200	99.96↑	-	-	-	0.001↓	O²: 10ppm or less
-	C12220	99.90↑	-	0.040 ~ 0.065	-	0.01↓	P: 450ppm Target

Mechanical Properties


KS/JIS	UNIS
-	-	-	-	-	-	-	-

Plaing Properties of Oxygen Free Copper and Pyrophosphate Copper


Electrolyte	Acid and alkali in common/cyanide solution	Acid designated/acid copper sulphate
Current Density	High: appr. 3A/dm²	Low to medium: appr. 2.2A/dm²
Polishing	Not polished	Polished
Plating Method	Horizontal	Vertical
Use	Plating of high performance PCB and electroless plating	Plating of high performance PCB and undercoating of general products
Remarks	Favorable to precise plating	Favorable to mass production